• Source: COM-HPC

The computer-on-module for high performance compute (COM-HPC) form factor standard targets high I/O and computer performance levels. Each COM-HPC module integrates core CPU and memory functionality and input and output including USB up to Gen 4, audio (MIPI SoundWire, I2S and DMIC), graphics, (PCI Express) up to Gen. 5, and Ethernet up to 25 Gbit/s per lane. All I/O signals are mapped to two high density, high speed and low profile connectors on the bottom side of the module. COM-HPC employs a mezzanine-based approach. The COM modules plug into a carrier or base board that is typically customized to the application. Over time, the COM-HPC mezzanine modules can be upgraded to newer, backwards-compatible versions. COM-HPC targets Industrial, Military/Aerospace, Gaming, Medical, Transportation, IoT, and General Computing embedded applications and even scales up to RAM and performance hungry server or edge server applications.




History


The PICMG work-group officially started in October 23, 2018.

Rev. 1.00 Release date: Feb 19, 2021
Rev. 1.10 added HD Audio as alternative for SoundWire, functional safetey signals and a second 5V standby power pin. Release date: Jan 21, 2022
Rev. 1.20 added definition for the Mini. Release date: Oct. 3, 2023
Rev. 1.30 work started June 25, 2024. Major topics for the workgroup are:
Signal integrity for PCIe Gen 6
Modern Standby S0ix
CXL




Types


There are 3 different pin outs defined in the specification.




Size


The specification defines 6 module sizes:

Size Mini: 95 × 70 mm (3.7 × 2.8 in)
The sizes A, B and C are typical Client Type sizes.

Size A: 95 × 120 mm (3.7 × 4.7 in)
Size B: 120 × 120 mm (4.7 × 4.7 in)
Size C: 160 × 120 mm (6.3 × 4.7 in)
The larger D and E sizes are typical Server Type sizes to support full size DRAM modules

Size D: 160 × 160 mm (6.3 × 6.3 in)
Size E: 200 × 160 mm (7.9 × 6.3 in)




Specification


The COM-HPC specification is hosted by PICMG. It is not freely available but may be purchased from the PICMG website.
PICMG provides a preview version for free download.
The COM-HPC hardware specification will be released Jan 2021.
Further COM-HPC related documents will be released in 2021

Carrier Board Design Guide for Ethernet KR
Full Carrier Board Design Guide
Platform Management Specification
Embedded EEPROM Specification (EEEP)




See also


ETX
XTX
Qseven
SMARC
COM Express




References






External links



COM-HPC Overview PICMG
COM-HPC Overview ADLINK
COM-HPC Overview congatec
COM-HPC Overview Kontron
COM-HPC Overview Samtec
COM-HPC Overview Advantech
COM-HPC Overview Avnet
COM-HPC Overview Comtel
COM-HPC Overview Eurotech
COM-HPC Overview Seco
COM-HPC Overview Trenz

Kata Kunci Pencarian:

• Lotte
• Windows Server
• TSMC
• Microsoft
• Tianhe-I
• Gloster E.28/39
• Meteorologi
• Perpustakaan medis
• Sepatu selajur
• Badai Erika (2003)
• COM-HPC
• Motherboard form factor
• COM Express
• Atari Portfolio
• Windows 95
• PelicanHPC
• Graphcore
• OpenHPC
• TOSS (operating system)
• Intel Xe