- Source: Gamal Refai-Ahmed
Gamal Refai-Ahmed is an Egyptian-Canadian-American engineer and technical executive known for his substantial contributions to thermal management, silicon architecture, and advanced packaging technologies. His work has had a significant impact on high-performance computing (HPC), artificial intelligence (AI), and microelectromechanical systems (MEMS). Refai Ahmed currently resides in the United States.
Early life and education
Refai Ahmed was born in Alexandria, Egypt. He completed his bachelor's degree in mechanical engineering from Alexandria University's Faculty of Engineering in 1985. He furthered his education in Canada, where he obtained a master's degree from the University of Waterloo in 1990, followed by a Ph.D. in mechanical engineering from the same institution in 1994. His doctoral research focused on the thermal management of electronics packaging.
Career
Refai Ahmed's career spans over three decades, during which he has held senior technical positions at several leading technology companies, including AMD, GE, Cisco, and Nortel.
Nortel (1996–1999): He served as a senior member of the scientific staff, focusing on thermal tools and modeling for power supplies.
Cisco Systems Canada (2000–2001): Refai Ahmed was a thermal technical leader, developing thermal architectures for new routers and optical shelves.
Advanced Micro Devices (2006–2011): In his role as a fellow and thermal domain expert, he defined technology directions for the Platform Products Group and developed thermal management architectures for graphics, multimedia, mobile, and digital TV applications.
PreQual Technologies Corp (2011–2013): He served as chief scientist and founder, defining technology directions for platform development and spearheading innovations in LED printing and green energy systems.
GE Global Research Center (2013–2014): As a senior technology architect, Refai Ahmed led the development of thermal management technology for GE's Intelligent Platform Controlling Systems and Healthcare Mobile Systems.
AMD and Xilinx (2015-Present): Refai Ahmed serves as a senior fellow and chief architect at AMD. He has played a pivotal role in developing advanced silicon power thermo-mechanical architectures, enhancing thermal management and packaging technologies for Xilinx products across telecom, data centers, and automotive sectors.
Honors and recognitions
Refai Ahmed has received numerous awards and honors throughout his distinguished career:
2004: Elected as a Fellow of ASME, acknowledging his contributions to mechanical engineering and thermal management.
2010: Received the Calvin W. Rice Lecture from the American Society of Mechanical Engineers (ASME).
2010: Elected as a Fellow of the Canadian Academy of Engineering (CAE).
2014: Received the IEEE Canada R.H. Tanner Industrial Leadership Silver Medal Award.
2017: Named Innovation Leader of the Year by the Integrated Electronics Engineering Center (IEEC) at Binghamton State University.
2019: Awarded the Presidential Medal from Binghamton University of New York for Innovation Leadership and Academic Contributions.
2020: Elected as a Fellow of the Engineering Institute of Canada (EIC).
2020: Elevated to IEEE Fellow, recognizing his contributions to electronic packaging.
2024: Elected as a Member of the National Academy of Engineering (NAE).
2024: Recipient of Alumni Achievement Medal for Professional Achievement from Faculty of Engineering, University of Waterloo.
Publications and Patents
Dr. Refai Ahmed has published extensively on topics related to thermal management, packaging technology, and high-performance computing. His recent publications have appeared in IEEE, ASME, and other leading journals. He holds over 160 patents in semiconductor packaging, thermal management solutions, and electronic cooling technologies.
Professional Affiliations
Dr. Refai Ahmed is actively involved in professional societies and committees. He has served on the IEEE Fellow Committee, the Executive Member of the High-Density Packaging (HIR) Technical Working Group, and the Advisory Board of the NSF E2S Center. Additionally, he has been an associate editor for several journals, including the *Journal of Thermal Science and Engineering Applications* and the *Journal of Electronics Packaging*.