• Source: MIL-STD-883

The MIL-STD-883 standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within military and aerospace electronic systems including basic environmental tests to determine resistance to deleterious effects of natural elements and conditions surrounding military and space operations; mechanical and electrical tests; workmanship and training procedures; and such other controls and constraints as have been deemed necessary to ensure a uniform level of quality and reliability suitable to the intended applications of those devices. For this standard, the term "devices" includes monolithic, multichip, film and hybrid microcircuits, microcircuit arrays, and the elements from which the circuits and arrays are formed. This standard is intended to apply only to microelectronic devices.
The standard was issued by the Department of Defense, US.




Environmental tests, methods 1001-1034


1001 Barometric pressure, reduced (altitude operation)
1002 Immersion
1003 Insulation resistance
1004.7 Moisture resistance
1005.8 Steady-state life
1006 Intermittent life
1007 Agree life
1008.2 Stabilization bake
1009.8 Salt atmosphere
1010.8 Temperature cycling
1011.9 Thermal shock
1012.1 Thermal characteristics
1013 Dew point
1014.13 Seal
1015.10 Burn-in test
1016.2 Life/reliability characterization tests
1017.2 Neutron irradiation
1018.6 Internal gas analysis
1019.8 Ionizing radiation (total dose) test procedure
1020.1 Dose rate induced latchup test procedure
1021.3 Dose rate upset testing of digital microcircuits
1022 Mosfet threshold voltage
1023.3 Dose rate response of linear microcircuits
1030.2 Preseal burn-in
1031 Thin film corrosion test
1032.1 Package induced soft error test procedure
1033 Endurance life test
1034.1 Dye penetrant test




Mechanical tests, methods 2001-2036


2001.2 Constant acceleration
2002.3 Mechanical shock
2003.7 Solderability
2004.5 Lead integrity
2005.2 Vibration fatigue
2006.1 Vibration noise
2007.2 Vibration, variable frequency
2008.1 Visual and mechanical
2009.9 External visual
2010.10 Internal visual (monolithic)
2011.7 Bond strength (bond pull test)
2012.7 Radiography
2013.1 Internal visual inspection for DPA
2014 Internal visual and mechanical
2015.11 Resistance to solvents
2016 Physical dimensions
2017.7 Internal visual (hybrid)
2018.3 Scanning electron microscope (SEM) inspection of metallization
2019.5 Die shear strength
2020.7 Particle impact noise detection test (PIND)
2021.3 Glassivation layer integrity
2022.2 Wetting balance solderability
2023.5 Nondestructive bond pull
2024.2 Lid torque for glass-frit-sealed packages
2025.4 Adhesion of lead finish
2026 Random vibration
2027.2 Substrate attach strength
2028.4 Pin grid package destructive lead pull test
2029 Ceramic chip carrier bond strength
2030 Ultrasonic inspection of die attach
2031.1 Flip chip pull-off test
2032.1 Visual inspection of passive elements
2035 Ultrasonic inspection of TAB bonds
2036 Resistance to soldering heat




Electrical tests (digital), methods 3001-3024


3001.1 Drive source, dynamic
3002.1 Load conditions
3003.1 Delay measurements
3004.1 Transition time measurements
3005.1 Power supply current
3006.1 High level output voltage
3007.1 Low level output voltage
3008.1 Breakdown voltage, input or output
3009.1 Input current, low level
3010.1 Input current, high level
3011.1 Output short circuit current
3012.1 Terminal capacitance
3013.1 Noise margin measurements for digital microelectronic devices
3014 Functional testing
3015.8 Electrostatic discharge sensitivity classification
3016 Activation time verification
3017 Microelectronics package digital signal transmission
3018 Crosstalk measurements for digital microelectronic device packages
3019.1 Ground and power supply impedance measurements for digital microelectronics device packages
3020 High impedance (off-state) low-level output leakage current
3021 High impedance (off-state) high-level output leakage current
3022 Input clamp voltage
3023.1 Static latch-up measurements for digital CMOS microelectronic devices
3024 Simultaneous switching noise measurements for digital microelectronic devices




Electrical tests (linear), methods 4001-4007


4001.1 Input offset voltage and current and bias current
4002.1 Phase margin and slew rate measurements
4003.1 Common mode input voltage range, Common mode rejection ratio, Supply voltage rejection ratio
4004.2 Open loop performance
4005.1 Output performance
4006.1 Power gain and noise figure
4007 Automatic gain control range




Test procedures, methods 5001-5013


5001 Parameter mean value control
5002.1 Parameter distribution control
5003 Failure analysis procedures for microcircuits
5004.11 Screening procedures
5005.15 Qualification and quality conformance procedures
5006 Limit testing
5007.7 Wafer lot acceptance
5008.9 Test procedures for hybrid and multichip microcircuits
5009.1 Destructive physical analysis
5010.4 Test procedures for custom monolithic microcircuits
5011.5 Evaluation and acceptance procedures for polymeric adhesives
5012.1 Fault coverage measurement for digital microcircuits
5013 Wafer fabrication control and wafer acceptance procedures for processed GaAs wafers




References






External links


MIL-STD-883 - Test method standard for microcircuits (MIL-STD-883 has no government copyrights and written with the expressed intention of being emulated and expressed exactly as-is, and as singular reference)
MIL-PRF-19500 - Semiconductor Devices, General Specification For.
MIL-PRF-38534 - Hybrid Microcircuits, General Specification For.
MIL-PRF-38535 - Integrated Circuits (Microcircuits) Manufacturing, General Specification For.
MIL-STD-1835 - Electronic Component Case Outlines.

Kata Kunci Pencarian:

• MIL-STD-883
• United States Military Standard
• Human-body model
• Flatpack (electronics)
• Wire bonding
• Pull off test
• Electrostatic discharge
• MIL-PRF-38535
• PIND
• Solderability