The "28 nm" lithography process is a half-node semiconductor manufacturing process based on a die shrink of the "32 nm" lithography process. It appeared in production in 2010.
Since at least 1997, "process nodes" have been named purely on a marketing basis, and have no direct relation to the dimensions on the integrated circuit; neither gate length, metal pitch or gate pitch on a "28nm" device is twenty-eight nanometers.
Taiwan Semiconductor Manufacturing Company has offered "28 nm" production using high-K metal gate process technology.
GlobalFoundries offers a "28nm" foundry process called the "28SLPe" ("28nm Super Low Power") foundry process, which uses high-K metal gate technology.
According to a 2016 presentation by Sophie Wilson, 28nm has the lowest cost per logic gate. Cost per gate had decreased as processes shrunk until reaching 28nm, and has slowly risen since then.
NM - Se | PDF
NM Flowchart | PDF
A Review of TSMC 28 nm Process Technology | TechInsights
A Review of TSMC 28 nm Process Technology | TechInsights
A Review of TSMC 28 nm Process Technology | TechInsights
A Review of TSMC 28 nm Process Technology | TechInsights
Process Variation: GF 40-nm vs. 28-nm. Increased variation was also ...
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The never ending story of TSMC's 28nm process - PC Perspective
Mi-28NM attack helicopter – RuAviation
Simple process flow of 28nm gate-last MOSFET devices. | Download ...
Simple process flow of 28nm gate-last MOSFET devices. | Download ...
